2

Capability

这里是标题一h1占位文字

project category General competence Extreme ability project category General competence Extreme ability
The number of finished board layers Flex board 1-4 floors 6 floors Surface treatment Nickel gold plating Plating Thin Gold:Ni:2-6um,Au: 0.05-0.015um  
Rigid-flex plates 3-4 floors 8 floors Plating Thin Gold:NI:2-12um,Au:0.25-2.5um  
Finished product size Imposition size Ordinary board maximum: 250*450mm multilayer board: 250*380 250*520mm Nickel gold Ni:2-6um,Au:0.025-0.1um  
Minimum: 250*180mm   Silk screening The minimum line width for text 0.11mm  
Maximum size of single PCS 240*500mm   Minimum character height 0.8mm  
Single PCS minimum size 5*5mm   Character offset tolerance ±0.3mm 0.2mm (print)
The maximum board thickness of the multilayer board 0.40mm 0.45mm Solder mask Ink thickness tolerance ±5um  
The minimum board thickness of the multilayer board 0.18mm 0.15mm Minimum width of the mask bridge 0.12mm  
Maximum plate thickness for both panels 0.25mm   Alignment tolerance ±0.05mm ±0.04mm
Minimum plate thickness for both sides 0.11mm   assemble FR4 / adhesive paper / steel sheet / PI Machine mount± 0.1mm  
Maximum plate thickness for single panel 0.18mm   Hand sticker± 0.2mm  
Minimum board thickness for single panel 0.05mm   shape External dimension tolerances Precision mold: ±0.05mm  
The maximum thickness of the rigid plate hardboard area 1.0mm   Normal mold: ±0.075mm  
Minimum thickness of the rigid-flex plate 0.16mm   Etching knife die: ±0.125mm  
Mature plate thickness tolerance ± 0.03mm, or 10% of plate thickness ± (whichever is the maximum of both)   Minimum distance from the line to the board edge Automotive 0.3mm, ordinary board 0.2mm, multilayer board 0.2mm Normal plate 0.15mm
drill Maximum aperture 6.5mm   Product electrical properties Test the voltage 200V  
Minimum aperture 0.1mm   Insulation test resistance 10-20MΩ  
Through-hole pad minimum 0.3mm 0.25mm Conduction test impedance ≦50Ω  
Drilling tolerances ±0.025mm   Finished board impedance Differential Tolerance±10%  
Target punch Target perforation tolerance ±0.02mm   Characteristic partial impedance± 10%  
Target impulse position tolerance ±0.025mm   The ground resistance value ≦ 3Ω  
Copper thickness Base copper thickness Max 3oz (105um, wireless charging)   Product physical properties Solder testing 265±5 °C, time 3 seconds, tin area more than 95%.  
Minimum: 1/3oz(12um) 1/4oz (with 1/3oz copper reduction) Thermal shock test 288±5 °C, time 10 seconds 3 times, no stratification and foaming  
Pore copper uniformity Independent hole ± 5um, whole plate hole ±4um   Substrate peel strength ≧1.0kgf/cm  
Face copper uniformity ±3um   Adhesion test Glued to the plating layer with 3m600 tape, still for 10 seconds, pulled up instantly at 90 degrees, no falling off  
Hole wall thickness ≧8um   SMT Chip devices It can process the smallest size resistors, capacitors, and inductors 01005  
line Minimum linewidth line spacing 0.05/0.05mm（1/3oz) 0.035/0.035mm（1/4oz) BTB connector It can process the smallest Pitch BTB device 0.35mm  
Line width tolerance Line width≧ 0.06mm: ±0.02mm (1/3oz)   ZIF connector It can process Pitch ZIF devices as small as 0.35mm  
线宽<0.06mm：±0.0125mm（1/3oz) ±0.01mm（1/3oz) LGA It can process Pitch LGA devices as small as 0.35mm  
Pad tolerances ±0.03mm ±0.02mm QFN It can process Pitch QFN devices as small as 0.35mm  
Line-to-profile tolerances ±0.2mm ±0.15mm Piece offset accuracy ±0.04mm  
Through-hole hole ring width Minimum 0.1mm Minimum 0.075mm Dispensing capabilities The minimum size of the spillage amount < 0.5mm  
CVL
(Overlay Film)		 Window size tolerance ±0.075mm (steel mold) ±0.05mm (precision die and laser engraving) The minimum height of the device surface after wrapping the device is controlled < 0.1mm  
Minimum opening size of the window 0.5mm   Solder paste printing thickness ±0.03mm  
Minimum distance from edge to edge of the window 0.5mm 0.4mm        
Fit tolerances ±0.15mm ±0.1mm (expensive)        
Overflow size ≦0.15mm