TECHNOLOGY
Process capability
- Categories:Technological capability
- Time of issue:2019-08-22 00:00:00
- Views:0
Description:制程能力
Information
| project | category | Conventional ability | Ultimate ability | project | category | Conventional ability | Ultimate ability |
| Number of finished boards | Soft board | 1-4 floors | 6floors | Surface treatment | Electroplated nickel gold | Plated gold：Ni：2-6um,Au： 0.05-0.015um | |
| Soft and hard board | 3-4floors | 8floors | Thick gold plating：NI：2-12um,Au：0.25-2.5um | ||||
| Product size | Imposition size | Ordinary board maximum：250*450mm Multilayer board：250*380 | 250*520mm | Nickel gold | Ni：2-6um,Au：0.025-0.1um | ||
| Minimum：250*180mm | Silk screen | Minimum line width of text | 0.11mm | ||||
| Single pcs maximum size | 240*500mm | Minimum height of text | 0.8mm | ||||
| Single pcs minimum size | 5*5mm | Character offset tolerance | ±0.3mm | 0.2mm（Printing） | |||
| Multilayer board maximum thickness | 0.40mm | 0.45mm | Solder mask | Ink thickness tolerance | ±5um | ||
| Multilayer board minimum thickness | 0.18mm | 0.15mm | Solder solder bridge minimum width | 0.12mm | |||
| Double panel maximum thickness | 0.25mm | Alignment tolerance | ±0.05mm | ±0.04mm | |||
| Double panel minimum thickness | 0.11mm | Assembly | FR4/adhesive paper/steel sheet/PI | Machine sticker±0.1mm | |||
| Single panel maximum thickness | 0.18mm | Hand stickers±0.2mm | |||||
| Single panel minimum thickness | 0.05mm | Shape | Dimensional tolerance | Precision mold：±0.05mm | |||
| Soft and hard bond board hard plate area maximum thickness | 1.0mm | Ordinary mode：±0.075mm | |||||
| Soft and hard bonding board hard board area minimum thickness | 0.16mm | Etching die：±0.125mm | |||||
| Finished plate thickness tolerance | ±0.03mm, or ±10% of the plate thickness (take the maximum of both) | Line to board edge minimum distance | Car 0.3mm, ordinary board 0.2mm, multi-layer board 0.2mm | Ordinary board0.15mm | |||
| Drilling | Maximum aperture | 6.5mm | Product electrical performance | Test voltage | 200v | ||
| Minimum aperture | 0.1mm | Insulation test resistance | 10-20MΩ | ||||
| Through hole pad minimum | 0.3mm | 0.25mm | Conduction test impedance | ≦50Ω | |||
| Drilling tolerance | ±0.025mm | Finished board impedance | Differential impedance tolerance±10% | ||||
| Target rush | Target punching aperture tolerance | ±0.02mm | Characteristic impedance±10% | ||||
| Target punch position tolerance | ±0.025mm | Ground resistance≦3Ω | |||||
| Copper thickness | Bottom copper thickness | Maximum 3oz (105um, wireless charging) | Product physical properties | Solder test | 265±5°C, time 3 seconds, over 90% of tin area | ||
| Minimum：1/3oz(12um) | 1/4oz（Use 1/3oz to reduce copper） | Thermal shock test | 288±5°C, time 10 seconds 3 times, no delamination and blistering | ||||
| Hole copper uniformity | Independent hole ±5um, whole plate hole ±4um | Peel strength | ≧1.0kgf/cm | ||||
| Copper uniformity | ±3um | Adhesion test | Stick to the coating with 3m600 tape, stand still for 10 seconds, pull up at 90 degrees, no drop off | ||||
| Hole wall thickness | ≧8um | SMT | Chip device | Machinable minimum size resistance, capacitance, inductance 01005 | |||
| Line | Minimum line width | 0.05/0.05mm（1/3oz) | 0.035/0.035mm（1/4oz) | BTB connector | Machinable minimum Pitch BTB device 0.35mm | ||
| Line width tolerance | Line width≧0.06mm：±0.02mm（1/3oz) | ZIF connector | Machinable minimum Pitch ZIF device 0.35mm | ||||
| Line width<0.06mm：±0.0125mm（1/3oz) | ±0.01mm（1/3oz) | LGA | Machinable minimum Pitch LGA device 0.35mm | ||||
| Pad tolerance | ±0.03mm | ±0.02mm | QFN | Machinable minimum Pitch QFN device 0.35mm | |||
| Line to shape tolerance | ±0.2mm | ±0.15mm | Partial deviation accuracy | ±0.04mm | |||
| Through hole ring width | Minimum0.1mm | Minimum0.075mm | Dispensing ability | Minimum size of overflow<0.5mm | |||
|
CVL （cover film） |
Window size tolerance | ±0.075mm（Steel mold） | ±0.05mm（Precision mold and laser engraving） | Minimum height control of the device surface after wrapping the device<0.1mm | |||
| Opening window minimum opening size | 0.5mm | Solder paste printing thickness | ±0.03mm | ||||
| Minimum distance from side to side | 0.5mm | 0.4mm | |||||
| Fit tolerance | ±0.15mm | ±0.1mm（Expensive） | |||||
| Overflow size | ≦0.15mm |
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Contact us
Shenzhen Zhengchuangjieyu Electronic Technology
Contacts：Pan Weixiang (Director of Marketing)
Contacts：Li Beibei (Customer Service Manager)
t e l ：0755-23700815
Website ：http://www.ccjyfpc.com
E-mail ：ccjy_fpc@163.com
Address ：No. 1001 A Building 6 Workshop, Shangxing West Industrial Zone, Shajing Street, Bao'an, Shenzhen